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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12624270 B1

PDFFull Text
Date of Patent:
May. 12, 2026

Filed:

Jun. 11, 2021

Silicone composition and a thermally conductive silicone cured product having high thermal conductivity

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yuya Hironaka, Annaka, JP;

Yasuhisa Ishihara, Annaka, JP;

Katsuyuki Tanaka, Annaka, JP;

Assignee:

Shin-Etsu Chemical Co., Ltd., Tokyo, JP;

Attorney:

Myers Bigel, P.A.

Primary Examiner:

Andrew J Oyer

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 7/18 (2006.01); C08K 13/04 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 13/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 7/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01);
Abstract

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

Find Patent Forward Citations

Hironaka, Yuya. (2026). Silicone composition and a thermally conductive silicone cured product having high thermal conductivity (U.S. Patent No. 12624270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12624270

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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