The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Mar. 10, 2021
Ebara Corporation, Tokyo, JP;
National University Corporation Tokai National Higher Education and Research System, Aichi, JP;
National University Corporation Kanazawa University, Ishikawa, JP;
Norikazu Suzuki, Aichi, JP;
Hozumi Yasuda, Tokyo, JP;
Yoshihiro Mochizuki, Tokyo, JP;
Yohei Hashimoto, Ishikawa, JP;
EBARA CORPORATION, Tokyo, JP;
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM, Aichi, JP;
NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY, Ishikawa, JP;
Abstract
The present invention relates to a cyber-physical system for optimizing a simulation model for chemical mechanical polishing based on actual measurement data of chemical mechanical polishing. The chemical mechanical polishing system includes a polishing apparatus () for polishing the workpiece (W) and an arithmetic system (). The arithmetic system () includes a simulation model including at least a physical model configured to output an estimated polishing physical quantity including an estimated polishing rate of the workpiece (W). The arithmetic system () is configured to: input polishing conditions for the workpiece (W) into the simulation model; output the estimated polishing physical quantity of the workpiece (W) from the simulation model; and determine model parameters of the simulation model that bring the estimated polishing physical quantity closer to a measured polishing physical quantity of the workpiece (W).