The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 14, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yohei Yamawaki, Kumamoto, JP;
Seiji Nakano, Kumamoto, JP;
Yoshihiro Kawaguchi, Kumamoto, JP;
Munehisa Kodama, Kumamoto, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/02 (2006.01); B08B 5/00 (2006.01); B24B 7/04 (2006.01); B24B 9/06 (2006.01); B24B 55/06 (2006.01); B24B 55/12 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 9/065 (2013.01); B08B 5/00 (2013.01); B24B 7/02 (2013.01); B24B 7/04 (2013.01); B24B 55/06 (2013.01); B24B 55/12 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01);
Abstract
A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.