logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12623258 B1

PDFFull Text
Date of Patent:
May. 12, 2026

Filed:

Feb. 01, 2023

Gas cleaning method, method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takahiro Kobayashi, Toyama, JP;

Iwao Nakamura, Toyama, JP;

Toru Harada, Toyama, JP;

Hisashi Nomura, Toyama, JP;

Sadayoshi Horii, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

S M Sohel Imtiaz

Int. Cl.
CPC ...
B08B 5/00 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B08B 5/00 (2013.01); C23C 16/4404 (2013.01); C23C 16/4405 (2013.01); H01L 21/02164 (2013.01); H01L 21/0223 (2013.01); H01L 21/02255 (2013.01);
Abstract

A gas cleaning method includes: (a) removing a first metal element as one of contaminants from a process chamber by supplying a chlorine-containing gas into the process chamber without supplying an oxygen-containing gas; and (b) removing a second metal element as another one of the contaminants from the process chamber by supplying the oxygen-containing gas into the process chamber, wherein (b) is performed after (a).

Find Patent Forward Citations

Kobayashi, Takahiro. (2026). Gas cleaning method, method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (U.S. Patent No. 12623258). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12623258

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…