logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12622336 B1

PDFFull Text
Date of Patent:
May. 05, 2026

Filed:

May. 19, 2023

Bonding layer and process

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Scott Lefevre, Albany, NY (US);

Adam Gildea, Albany, NY (US);

Satohiko Hoshino, Koshi City, JP;

Sophia Madelone, Albany, NY (US);

Yuji Mimura, Koshi City, JP;

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 24/08 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/8022 (2013.01); H01L 2224/80379 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second substrate. The method includes bonding the first substrate to the second substrate by making physical contact between the first bonding surface and second bonding surface. The method further includes applying thermal energy or light to the bonding layer.

Find Patent Forward Citations

Lefevre, Scott. (2026). Bonding layer and process (U.S. Patent No. 12622336). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622336

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…