The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Dec. 21, 2021
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Tempe, AZ (US);
Stephen R. Van Doren, Portland, OR (US);
Ritu Gupta, Sunnyvale, CA (US);
Gerald S. Pasdast, San Jose, CA (US);
Robert J. Munoz, Round Rock, TX (US);
Shawna M. Liff, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies arranged in an array of rows and columns in a first layer; and a second plurality of IC dies in a second layer not coplanar with the first layer. A first IC die in the first plurality is differently sized than surrounding IC dies in the first plurality, and a second IC die in the second plurality coupled to the first IC die comprises at least one of: a repeater circuitry and a fanout structure in an electrical pathway coupling the first IC die with an adjacent IC die in the first plurality.