The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
May. 24, 2023
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Akira Morozumi, Okaya, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/24 (2006.01); H01L 23/26 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 23/053 (2013.01); H01L 23/26 (2013.01); H01L 23/49811 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/164 (2013.01);
Abstract
A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.
Morozumi, Akira. (2026). Semiconductor module (U.S. Patent No. 12622315). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622315
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile