The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Apr. 07, 2025
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Rasit Onur Topaloglu, Poughkeepsie, NY (US);
Belgacem Haba, Saratoga, CA (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
Embodiments herein provide for an integrated cooling assembly and methods of forming the same. The integrated cooling assembly comprises an interposer, a plurality of semiconductor devices, a first cold plate, and at least one second cold plate. The interposer has a first side and a second side opposite the first side. The plurality of semiconductor devices are attached to the first side of the interposer. A first cold plate is attached to at least one of the plurality of first semiconductor devices. At least one second cold plate is attached to the second side of the interposer.