The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Aug. 12, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Reinaldo Vega, Mahopac, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Albert M. Chu, Nashua, NH (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Brent A. Anderson, Jericho, VT (US);

Takashi Ando, Eastchester, NY (US);

David Wolpert, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10D 84/85 (2025.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/435 (2026.01); H10W 20/42 (2026.01); H10D 84/859 (2025.01);
Abstract

A semiconductor device architecture includes a substrate and a device region including active components carried by the substrate. A plurality of tracks are on the substrate including conductive lines connecting power and signals to the active components in the device region. A first track includes a plurality of segments of a conductive line. A first segment in the first track delivers power to the device region. A second segment in the first track delivers a signal to the device region. The first segment and the second segment are arranged in the same first track.


Find Patent Forward Citations

Loading…