The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Jul. 07, 2021
Applicant:

Jenoptik Optical Systems Gmbh, Jena, DE;

Inventors:

Daniel Matthesius, Eichwalde, DE;

Torsten Trenkler, Berlin, DE;

Enrico Pertzsch, Schoenfeld, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 25/075 (2006.01); H10H 20/84 (2025.01);
U.S. Cl.
CPC ...
H10H 20/01335 (2025.01); H01L 25/0753 (2013.01); H10H 20/84 (2025.01); H10H 20/034 (2025.01);
Abstract

The invention relates to a method for producing an optical apparatus (). The method comprises a step of providing a substrate () on whose first main surface () a plurality of emission devices () for emitting electromagnetic radiation () are arranged. The substrate () is designed as a light-emitting diode wafer and/or formed from sapphire or gallium nitride and is transparent at least for one emission wavelength of the radiation () emitted by the emission devices (), The method also comprises a step of applying an absorption material () on the side of the first main surface () of the substrate (). The absorption material () has a photostructurable resist that absorbs at least the emission wavelength. The method further comprises a step of processing the absorbing material () in order to lay bare at least one emission surface () of each emission device (). In this case, a position determination of surfaces to be laid bare is carried out from a second main surface () of the substrate () opposite the first main surface (). In addition, the method comprises a step of singulating the substrate () into a plurality of optical apparatuses () by means of a separating manufacturing process, wherein each optical apparatus () has at least one emission device ().


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