The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jul. 17, 2023
Aeluma, Inc., Goleta, CA (US);
Aeluma, Inc., Goleta, CA (US);
Abstract
An integrated sensor array device and method. The method includes providing a partially completed semiconductor substrate having a material stack used to form a sensor array device with a plurality of device regions. One or more isolation trench regions separating the device regions can be formed in a front-end isolation process during the formation of the device regions or in a back-end isolation process following a bonding process to integrate the sensor array device to an integrated circuit (IC) device. Prior to the front-end or back-end processing, metal interconnect materials within a passivation material can be formed via a planarization process to provide connection to n-type and p-type contact regions of the sensor array device. The resulting planarized sensor array device can then be bonded to the IC device, and a plurality of surface relief structures can be formed overlying a backside surface region of the planarized sensor array device.