The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Sep. 23, 2022
Applicant:

Wolfspeed, Inc., Durahm, NC (US);

Inventors:

Kok Meng Kam, Ipoh, MY;

Eng Wah Woo, Ipoh, MY;

Samantha Cheang, Ipoh, MY;

Marvin Marbell, Cary, NC (US);

Haedong Jang, San Jose, CA (US);

Jeremy Fisher, Raleigh, NC (US);

Basim Noori, Durham, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H10D 1/68 (2025.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H01G 4/228 (2013.01); H10D 1/692 (2025.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 72/07336 (2026.01); H10W 72/921 (2026.01); H10W 72/952 (2026.01); H10W 90/734 (2026.01);
Abstract

In some aspects, a device includes a substrate. A first metallization arranged on the substrate. A second metallization arranged on the substrate. A circuit arranged on the substrate and electrically connected to the first metallization and the second metallization. The first metallization and the second metallization being configured, structured, and arranged to make a solder connection to a device, where the substrate may include silicon carbide (SiC).


Find Patent Forward Citations

Kam, Kok. (2026). Device and process for implementing silicon carbide (sic) surface mount devices (U.S. Patent No. 12620530). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12620530

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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