The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Mar. 31, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Santosh Shaw, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4243 (2013.01); G02B 6/4206 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13026 (2013.01);
Abstract
Embodiments disclosed herein include electronic devices and methods of forming electronic devices. In an embodiment, an electronic device comprises a die. In an embodiment, the die comprises a semiconductor substrate, a bump field over the semiconductor substrate, and a V-groove into the semiconductor substrate, wherein the V-groove extends to an edge of the semiconductor substrate. In an embodiment, the V-groove is free from conductive material. In an embodiment, the electronic device further comprises an optical fiber inserted into the V-groove.