The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jun. 23, 2022
Intel Corporation, Santa Clara, CA (US);
Benjamin T. Duong, Phoenix, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first layer of a substrate having a cavity; a first die at least partially nested in the cavity in the first layer of the substrate, the first die having a surface with conductive contacts; a liner layer on the first layer, in a portion of the cavity, and on and around the first die, wherein a material of the liner layer includes: silicon or aluminum, and one or more of nitrogen, oxygen, and carbon; a second layer on the liner layer, wherein the second layer extends into the cavity and is on and around the first die; and a second die on the second layer, wherein the second die is electrically coupled to the conductive contacts on the first die by conductive vias through the second layer and the liner layer.