The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Nov. 22, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Lun Chen, Taichung City, TW;

PO-Jen Shih, Tainan City, TW;

Ming-Sung Hung, Taichung City, TW;

Wen-Hung Hsu, Taichung City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); B08B 1/36 (2024.01); B08B 1/52 (2024.01); B08B 3/02 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68728 (2013.01); B08B 1/36 (2024.01); B08B 1/52 (2024.01); B08B 3/024 (2013.01); H01L 21/02057 (2013.01); H01L 21/0206 (2013.01); H01L 21/304 (2013.01); H01L 21/6704 (2013.01); H01L 21/67051 (2013.01);
Abstract

A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.


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