The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Feb. 24, 2022
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Koei Kuribayashi, Toyama, JP;

Tatsushi Ueda, Toyama, JP;

Katsuhiko Yamamoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 14/694 (2026.01); H10P 70/00 (2026.01);
U.S. Cl.
CPC ...
H10P 70/23 (2026.01); H01J 37/3244 (2013.01); H01J 37/32715 (2013.01); H01J 37/32862 (2013.01); H10P 14/69433 (2026.01); H01J 2237/20214 (2013.01);
Abstract

There is provided a technique capable of cleaning a film deposited on an outer peripheral portion of a substrate placing surface of a substrate support. According to one aspect thereof, a substrate processing apparatus includes: a process chamber where a product substrate is processed; a substrate support provided in the process chamber and provided with a substrate placing surface whereon the product substrate is placed; a process gas supplier wherethrough a process gas is supplied into the process chamber while the product substrate being placed on the substrate placing surface; and a cleaning gas supplier wherethrough a cleaning gas is supplied into the process chamber while a dummy substrate being placed on the substrate placing surface. An outer peripheral portion of the dummy substrate is out of contact with the substrate placing surface in a state where the dummy substrate is placed on the substrate placing surface.


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