The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Feb. 26, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yue Wei, Shanghai, CN;

Dahai Tian, Shanghai, CN;

Meng Wei, Shanghai, CN;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0655 (2013.01); G06F 3/0604 (2013.01); G06F 3/0676 (2013.01); G06F 3/0679 (2013.01);
Abstract

A write operation initiated by a memory sub-system controller of a memory sub-system to write system metadata to one or more of a plurality of dies of the a memory sub-system is identified by a processing device. A redundancy die of a plurality of dies of the memory sub-system is identified. One or more first physical blocks of the redundancy die is identified. A first write operation to write the system metadata to the one or more first physical blocks is performed.


Find Patent Forward Citations

Wei, Yue. (2026). Aggregating log data to a redundant die of a memory sub-system (U.S. Patent No. 12613654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12613654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…