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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12610835 B1

PDFFull Text
Date of Patent:
Apr. 21, 2026

Filed:

Aug. 26, 2022

Interposer substrate, package structure and manufacturing method of package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Yu Ling, Hsinchu City, TW;

Hsin-Yu Lai, Hsinchu, TW;

Katherine H Chiang, New Taipei City, TW;

Chung-Te Lin, Tainan City, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Michele Fan

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/162 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1443 (2013.01);
Abstract

Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the bridge device and a through substrate via in the substrate and beside the bridge device and the memory.

Find Patent Forward Citations

Ling, Chia-Yu. (2026). Interposer substrate, package structure and manufacturing method of package structure (U.S. Patent No. 12610835). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610835

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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