The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jul. 03, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Kuan-Liang Liu, Pingtung County, TW;
Chung-Liang Cheng, Changhua County, TW;
Yen Liang Wu, Tainan City, TW;
Chung-Yuan Li, Taichung City, TW;
Ya Chun Teng, Tainan City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure is provided. The semiconductor structure includes a first substrate and a second substrate. The first substrate includes a first semiconductor layer, including a first trench isolation that extends through a portion of the first substrate layer; and a first interconnect structure, disposed over the first semiconductor layer. The second substrate includes a second semiconductor layer, including a plurality of semiconductor islands and surrounded by at least a second isolation penetrating the second semiconductor layer; a second interconnect structure, disposed over the second substrate layer and bonded to the first interconnect structure; and a dielectric layer, disposed over the second semiconductor layer opposite to the second interconnect structure. A method of manufacturing the semiconductor structure is also provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile