The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Mar. 07, 2024
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Simon Bubel, Carrboro, NC (US);

Dinusha Priyadarshani Karunaratne, Cary, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 1/00 (2006.01); B24B 7/22 (2006.01); B24B 57/02 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); B24B 1/00 (2013.01); B24B 7/228 (2013.01); B24B 57/02 (2013.01);
Abstract

Systems and methods for grinding semiconductor workpieces are provided. In one example, a method includes providing a surface of the semiconductor workpiece against a grinding apparatus. The grinding apparatus includes an abrasive surface. The method further includes imparting relative motion between the abrasive surface and the semiconductor workpiece to implement a grinding operation on the semiconductor workpiece. The method further includes providing a fluid to the surface of the semiconductor workpiece or the abrasive surface during the grinding operation. The fluid includes an additive. The additive includes one or more of an oxidizing agent, an etchant, a surfactant, or a lubricant.


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