The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jan. 06, 2023
Semiconductor structure comprising storage chip bonded with control chip and method for forming same
Applicant:
Changxin Memory Technologies, Inc., Hefei City, CN;
Inventors:
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei City, CN;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H10B 12/315 (2023.02); H10B 12/0335 (2023.02); H10B 12/05 (2023.02); H10B 12/482 (2023.02); H10B 12/50 (2023.02); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01);
Abstract
A semiconductor structure includes a storage chip, a control chip, and a capacitor structure. The storage chip includes an array area. The control chip includes a peripheral area. The control chip and the storage chip are connected in a face-to-face bonding manner. The capacitor structure is located on a surface, away from a bonding surface, of the storage chip. The capacitor structure includes capacitors electrically connected to corresponding transistors in the array area.