The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Mar. 08, 2023
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Wen-Long Lu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 21/768 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 21/76871 (2013.01); H05K 1/024 (2013.01); H05K 3/40 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09218 (2013.01); H05K 2201/095 (2013.01); H05K 2203/0502 (2013.01);
Abstract

A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.


Find Patent Forward Citations

Loading…