The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Nov. 04, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kazuhito Tsuji, Tokyo, JP;

Kentaro Yamamoto, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); B05B 13/02 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01); C23C 18/16 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 21/08 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); B05B 13/0221 (2013.01); B08B 3/022 (2013.01); B08B 13/00 (2013.01); C23C 18/1669 (2013.01); C25D 7/12 (2013.01); C25D 17/00 (2013.01); C25D 17/001 (2013.01); C25D 17/004 (2013.01); C25D 21/08 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); H01L 21/02068 (2013.01);
Abstract

A substrate is efficiently cleaned. A plating moduleincludes: a plating tankconfigured to accommodate a plating solution; a substrate holderconfigured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanismconfigured to rotate the substrate holder; an inclination mechanismconfigured to incline the substrate holder; and a substrate cleaning memberfor cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder. The substrate cleaning memberis configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanismfrom a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism


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