The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Feb. 03, 2020
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Takashi Naito, Tokyo, JP;

Shinichi Tachizono, Tokyo, JP;

Yuji Hashiba, Tokyo, JP;

Tatsuya Miyake, Tokyo, JP;

Taigo Onodera, Tokyo, JP;

Takuya Aoyagi, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/18 (2006.01); C03C 8/20 (2006.01); C03C 8/24 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
C03C 8/18 (2013.01); C03C 8/20 (2013.01); C03C 8/24 (2013.01); H01L 23/291 (2013.01); H01L 23/3142 (2013.01); H10K 59/8722 (2023.02);
Abstract

A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.[AgO]≥[TeO]≥[VO]≥[LiO]  (1)2[VO]≥[AgO]+[LiO]≥40  (2)(In the formula, [X] represents a content of component X, and the unit thereof is 'mol %'; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.


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