The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jun. 06, 2023
Denso Corporation, Kariya-city, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Kei Endo, Kariya-city, JP;
Kazuyuki Hamamoto, Kariya-city, JP;
Hisashi Tokutomi, Tokyo, JP;
Motohiro Onitsuka, Tokyo, JP;
Yoko Kurasawa, Tokyo, JP;
DENSO CORPORATION, Kariya-city, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portion from the through hole; a heating step that heats the thread solder piece with the cylindrical soldering iron and causes to melt the thread solder piece at the solder object portion; and a curing step that cures a melting object of the thread solder piece to solder the solder object portion. The thread solder piece is composed of a core containing a flux and a coating member containing a solder alloy that covers the core. The flux has a rosin having an acid value which is substantially as a main component thereof.