The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Jan. 23, 2023
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Ryo Nomaguchi, Matsumoto-city, JP;

Takahito Harada, Matsumoto-city, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H05K 1/0296 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract

A semiconductor module, including a first main wiring line connecting portion and a second main wiring line connecting portion, and a main output wiring line connecting portion is provided. The circuit board includes a circuit region in which the first circuit and the second circuit are arranged alongside each other in the first direction, and a first connecting region and a second connecting region arranged sandwiching the circuit region in a second direction orthogonal to the first direction. The first main wiring line connecting portion and the second main wiring line connecting portion are provided in the first connecting region, and the main output wiring line connecting portion is provided in the second connecting region.


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