The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Feb. 15, 2023
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Kazuki Sugiura, Tokyo, JP;
Takashi Mori, Tokyo, JP;
Yoshinori Kakinuma, Tokyo, JP;
Tetsuya Hosono, Tokyo, JP;
Kaoru Amano, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); H10D 84/01 (2026.01); H10P 70/00 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); H10D 84/01 (2025.01); H10P 70/23 (2026.01); H10P 72/0404 (2026.01); H10P 72/0442 (2026.01); H10P 72/7412 (2026.01); H10P 72/7442 (2026.01);
Abstract
A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.