The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Oct. 03, 2023
Disco Corporation, Tokyo, JP;
Takumi Kohei, Tokyo, JP;
Suguru Hiraiwa, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of manufacturing a plurality of chips by dividing a workpiece having a substrate harder than a monocrystalline Si substrate includes a cut groove forming step of, while holding the workpiece on a holding table with a surface of the workpiece being exposed, cutting the workpiece along each of projected dicing lines with a first cutting blade as it is vibrating at a frequency in the ultrasonic band, to form a cut groove in the workpiece such that the cut groove extends from the surface of the workpiece and terminates short of another surface of the workpiece, and a dividing step of, while holding the workpiece on the holding table with the other surface of the workpiece being exposed, cutting off an uncut residual portion from the workpiece along each of the lines with a second cutting blade to divide the workpiece into a plurality of chips.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile