The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Dec. 17, 2021
Intel Corporation, Santa Clara, CA (US);
Ali Kalantarian, Richmond Hill, CA;
Malcolm Gutenburg, Vancouver, CA;
Andrew Randell, Waterloo, CA;
Mirui Wang, Oshawa, CA;
Tejas Shah, Austin, TX (US);
Tamara J. Low Foon, Toronto, CA;
Jason Lee Pack, North York, CA;
Yvan Large, Richmond Hill, CA;
Shahin Amiri, Richmond Hill, CA;
Saanjali Maharaj, Toronto, CA;
Srinivasarao Konakalla, Bangalore, IN;
Feroze Khan, Bangalore, IN;
Nagaraj K, Bangalore, IN;
Babu Triplicane Gopikrishnan, Bangalore, IN;
Yogesh Channaiah, Mandya, IN;
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.