The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Jun. 02, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei Lee, Hsinchu City, TW;
Chung-Liang Cheng, Changhua County, TW;
Pei-Wen Liu, Hsinchu City, TW;
Ke-Wei Su, Hsinchu County, TW;
Kuan-Lun Cheng, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device includes a substrate, an interconnect, and a sensor. The substrate includes devices therein and has a front side and a rear side opposite to the front side. The interconnect is disposed on the front side and electrically coupled to the devices. The sensor is disposed over the substrate and in the interconnect, and includes a sensing element and a reference element. The sensing element is disposed in a topmost layer of the interconnect and exposed therefrom, where the sensing element is electrically coupled to a first device of the devices through the interconnect. The reference element is disposed in the topmost layer of the interconnect and exposed therefrom, where the reference element is laterally spaced from the sensing element and is electrically coupled to a second device of the devices through the interconnect.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile