The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Feb. 18, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Satoshi Tsutsui, Kanagawa, JP;
Kazunari Ishizuka, Shizuoka, JP;
Miho Ishii, Kanagawa, JP;
Yohei Hamade, Tokyo, JP;
Haruka Yamaji, Tokyo, JP;
Hikaru Sugimoto, Kanagawa, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for producing a laminate of a cured material from a photosensitive resin composition () and a photosensitive resin composition (), wherein the method includes a step of obtaining a laminated material by laminating the composition () onto the composition (); a step of subjecting the laminated material to photoexposure to obtain a photocured material; a step of developing the photocured material to obtain a developed material; and a step of heating the developed material to obtain a laminate, wherein the photoexposure dose required to cure the composition () is smaller than the dose required to cure the composition (), and wherein the composition () contains an epoxy resin () having a weight-average molecular weight Mw of 5,000 to 600,000, a softening point of at least 140° C., and an epoxy equivalent weight of not more than 2,300.