The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Oct. 12, 2023
Winbond Electronics Corp., Taichung City, TW;
PO-Chun Shao, Hsinchu City, TW;
Ping-Lung Yu, Hsinchu City, TW;
WINBOND ELECTRONICS CORP., Taichung City, TW;
Abstract
A semiconductor structure includes a semiconductor substrate, an insulating layer, a conductive feature and an anisotropic conductive structure. The insulating layer is disposed above the semiconductor substrate. The conductive feature is disposed in the insulating layer, wherein a top surface of the conductive feature is adjacent to a top surface of the insulating layer. The anisotropic conductive structure is disposed on the insulating layer and the conductive feature. The anisotropic conductive structure includes a metal oxide porous layer and conductive pillars. The metal oxide porous layer has a first nano-through-hole array exposing the top surface of the conductive feature and a second nano-through-hole array exposing the top surface of the insulating layer. The conductive pillars fill the first nano-through-hole array, wherein the conductive pillars are in contact with the top surface of the conductive feature.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile