The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Apr. 28, 2023
Applicant:

Littelfuse, Inc., Chicago, IL (US);

Inventors:

Aalok Bhatt, Bremen, DE;

Francois Perraud, Bremen, DE;

Cynthia Selke, Bremen, DE;

Rhodri Hughes, Wilts, GB;

Tiburcio Maldo, Batangas, PH;

Assignee:

Littelfuse, Inc., Rosemont, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3107 (2013.01);
Abstract

A substrate package arrangement may include a substrate that contains a ceramic body, a top metal layer, disposed on a top side of the ceramic body, and a bottom metal layer, disposed on a bottom side of the ceramic body, opposite the top surface. The substrate package arrangement may further include a lead structure, electrically connected to the top metal layer, and being electrically isolated from the bottom metal layer, wherein the substrate and lead structure are arranged in a discrete package, and wherein the ceramic body is formed of a high thermal conductivity material.


Find Patent Forward Citations

Bhatt, Aalok. (2026). Electrically isolated discrete package with high performance ceramic substrate (U.S. Patent No. 12598990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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