The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Mar. 02, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Andreas Fischer, Castro Valley, CA (US);

Aaron Lynn Routzahn, Fremont, CA (US);

Thorsten Bernd Lill, Kalaheo, HI (US);

Seshasayee Varadarajan, Lake Oswego, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); C23F 1/02 (2006.01); H01J 37/32 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H10B 69/00 (2023.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); C23F 1/02 (2013.01); H01J 37/32357 (2013.01); H01J 37/32522 (2013.01); H01L 21/32136 (2013.01); H01L 21/32138 (2013.01); H01L 21/67207 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01L 21/67167 (2013.01); H10B 69/00 (2023.02);
Abstract

Molybdenum is etched in a highly controllable manner by performing one or more etch cycles, where each cycle involves exposing the substrate having a molybdenum layer to an oxygen-containing reactant to form molybdenum oxide followed by treatment with boron trichloride to convert molybdenum oxide to a volatile molybdenum oxychloride with subsequent treatment of the substrate with a fluorine-containing reactant to remove boron oxide that has formed in a previous reaction, from the surface of the substrate. In some embodiments the method is performed in an absence of plasma and results in a substantially isotropic etching. The method can be used in a variety of applications in semiconductor processing, such as in wordline isolation in 3D NAND fabrication.


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