The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Jan. 04, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Vladimir Odnoblyudov, Eagle, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/018 (2025.01); H10H 29/142 (2025.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12044 (2013.01);
Abstract
A wafer-level process for manufacturing solid state lighting ('SSL') devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.
Odnoblyudov, Vladimir. (2026). Solid state optoelectronic device with preformed metal support substrate (U.S. Patent No. 12598845). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598845
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile