The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
May. 09, 2024
Applied Materials, Inc., Santa Clara, CA (US);
Paul R. Mchugh, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
John L. Klocke, Kalispell, MT (US);
APPLIED Materials, Inc., Santa Clara, CA (US);
Abstract
An electroplating system including a Cu bath disposed within a vessel, the Cu bath characterized by a predetermined threshold of Cu concentration, and a predetermined threshold of acid concentration, and where a substrate is submerged in the Cu bath; and a jet array configured to spray a fluid onto the substrate, where the fluid has a same composition as the Cu bath. Further, a method including spraying a fluid onto a substrate with the jet array, wherein the fluid has a same composition as the Cu bath and where spraying the substrate increases a deposition rate of a deposited Cu onto the substrate, where the predetermined threshold of acid concentration increases a bath conductivity of the Cu bath, and where the increased bath conductivity improves a coplanarity of deposited copper structure.