The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Mar. 27, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Volker Geissler, Freital, DE;

Benjamin Cherian, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/04 (2006.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
B24B 49/04 (2013.01); B24B 51/00 (2013.01);
Abstract

A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the plurality of time-varying test signals on a display with the plurality of time-varying test signals overlaid on each other in a graph. receiving user input selecting a box having a defined time range and defined signal value range, and receiving a selection of one from a preset group of boundary crossing logic functions to provide a selected boundary crossing logic function. During chemical mechanical polishing of a device substrate, the device substrate is monitored with the endpoint detection system to generate a time-varying signal and an endpoint determination can be based on whether the time-varying signal satisfies the selected boundary crossing logic function.


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