The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Dec. 23, 2022
Applicant:
Macom Technology Solutions Holdings, Inc., Lowell, MA (US);
Inventors:
Haedong Jang, San Jose, CA (US);
Mehdi Hasan, Milpitas, CA (US);
Marvin Marbell, Cary, NC (US);
Jeremy Fisher, Raleigh, NC (US);
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4817 (2013.01); H01L 23/053 (2013.01); H01L 23/367 (2013.01); H01L 24/48 (2013.01); H01L 25/165 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/48175 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/1421 (2013.01);
Abstract
A transistor device includes a metal submount; a transistor die arranged on said metal submount; an IPD component arranged on said metal submount, and the IPD component having a baseband damping resistor arranged on a thermally conductive dielectric substrate; and a second IPD component arranged on said metal submount, and the second IPD component may include a baseband decoupling capacitor arranged on a thermally conductive dielectric substrate.