The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jun. 07, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shi Ning Ju, Hsinchu City, TW;
Kuo-Cheng Chiang, Hsinchu County, TW;
Ching-Wei Tsai, Hsinchu City, TW;
Kuan-Lun Cheng, Hsin-Chu, TW;
Chih-Hao Wang, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method of fabricating a device includes providing a first fin in a first device type region and a second fin in a second device type region. Each of the first and second fins include a plurality of semiconductor channel layers. A two-step recess of an STI region on opposing sides of each of the first and second fins is performed to expose a first number of semiconductor channel layers of the first fin and a second number of semiconductor channel layers of the second fin. A first gate structure is formed in the first device type region and a second gate structure is formed in the second device type region. The first gate structure is formed over the first fin having the first number of exposed semiconductor channel layers, and the second gate structure is formed over the second fin having the second number of exposed semiconductor channel layers.