The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Jan. 04, 2023
Applicants:

Changxin Memory Technologies, Inc., Hefei City, CN;

Changxin Jidian (Beijing) Memory Technologies Co., Ltd., Beijing, CN;

Inventors:

Zhaopei Cui, Hefei City, CN;

Ying Song, Hefei City, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/482 (2023.02); H10B 12/09 (2023.02); H10B 12/488 (2023.02); H10B 12/50 (2023.02);
Abstract

The present disclosure provides a semiconductor structure and a manufacturing method thereof, and relates to the technical field of semiconductors. The semiconductor structure includes: a base, where the base includes a memory array region and a peripheral circuit region around the memory array region; a plurality of buried bit lines disposed in the memory array region of the base; and at least one buried gate disposed in the peripheral circuit region of the base.


Find Patent Forward Citations

Cui, Zhaopei. (2026). Semiconductor structure and manufacturing method thereof (U.S. Patent No. 12593443). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12593443

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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