The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jul. 23, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Ismael Franco Núñez, Milwaukie, OR (US);
Daqiao Du, Lake Oswego, OR (US);
Zhen Zhou, Chandler, AZ (US);
Gordon P. Melz, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/24 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H01R 13/2407 (2013.01); H01R 12/7082 (2013.01); H01R 12/714 (2013.01); H01R 12/57 (2013.01);
Abstract
In one embodiment, an interconnect apparatus (e.g., an interposer apparatus) includes a plurality of interconnect probes that each include a wave spring structure that includes a plurality of stacked wave spring discs. The wave spring discs may be formed in a sinusoidal wave form shape, or in another wave form shape.