The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Dec. 23, 2021
Intel Corporation, Santa Clara, CA (US);
John M. Heck, Berkeley, CA (US);
Haisheng Rong, Pleasanton, CA (US);
Harel Frish, Albuquerque, NM (US);
Ankur Agrawal, Chandler, AZ (US);
Boping Xie, San Ramon, CA (US);
Randal S. Appleton, Albuquerque, NM (US);
Hari Mahalingam, San Jose, CA (US);
Alexander Krichevsky, Cupertino, CA (US);
Pooya Tadayon, Portland, OR (US);
Ling Liao, Fremont, CA (US);
Eric J. M. Moret, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.