The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Feb. 24, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Sheng Lai, Taipei, TW;

Chun-Yuan Hsu, Hsinchu, TW;

Tzu-Chung Tsai, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 21/08 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C25D 21/08 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); H01L 21/67051 (2013.01);
Abstract

A base structure in an electroplating system is provided. The base structure includes: includes: an annular member; a contact ring attached to an inner surface of the annular member and configured to be electrically connected to a wafer in an electroplating process; and a pair of shield structures attached to an upper surface of the annular member and extending in an vertical direction. Each of the pair of shield structures includes: a curved plate comprising a plurality of discharging openings, wherein plating solution residual is discharged through the plurality of discharging openings in a cleaning procedure; and a plurality of bevels, each of the plurality of bevels corresponding to each of the plurality of discharging openings and configured to guide the plating solution residual toward the corresponding discharging opening in the cleaning procedure.


Find Patent Forward Citations

Lai, Chia-Sheng. (2026). Electroplating system including an improved base structure (U.S. Patent No. 12590381). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12590381

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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