The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Nov. 16, 2020
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 3/08 (2006.01); C08K 5/00 (2006.01); C09J 9/02 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 3/08 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0837 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0862 (2013.01); C08K 5/0025 (2013.01); C08K 2201/003 (2013.01); C09J 9/02 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); Y10T 428/2857 (2015.01); Y10T 428/287 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/2896 (2015.01);
Abstract
This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.