The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jun. 07, 2021
Toyo Seikan Group Holdings, Ltd., Tokyo, JP;
TOYO SEIKAN GROUP HOLDINGS, LTD., Tokyo, JP;
Abstract
An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cmor less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa·s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile