The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Mar. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jiwei Sun, Chandler, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Kemal Aygün, Tempe, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6616 (2013.01);
Abstract

Embodiments disclosed herein include electronic packages In an embodiment, the electronic package comprises first substrate layers, and a core under the first substrate layers. In an embodiment, second substrate layers are under the core, and an interconnect is through the first substrate layers, the core, and the second substrate layers. In an embodiment, a portion of the interconnect through the second substrate layers comprises a pad, and a plurality of vias extending away from the pad.


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