The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Oct. 20, 2023
Applicant:

Winbond Electronics Corp., Taichung City, TW;

Inventors:

Hsin-Hung Chou, Taichung City, TW;

Cheng-Shuai Li, Taichung City, TW;

Kao-Tsair Tsai, Taichung City, TW;

Assignee:

WINBOND ELECTRONICS CORP., Taichung City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 41/42 (2023.01); H10B 12/00 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H10B 41/42 (2023.02); H10B 43/40 (2023.02); H10B 12/48 (2023.02);
Abstract

A pick-up structure of a memory device and a method of manufacturing the memory device are provided. The pick-up structure includes pick-up electrode stripes. Each pickup electrode stripe includes a main body portion in the peripheral pick-up region and an extending portion extending from the main body portion to the memory cell region. The extending portion is narrower than the main body portion. The sidewall surface of the extending portion is aligned with the sidewall surface of the main body portion.


Find Patent Forward Citations

Chou, Hsin-Hung. (2026). Pick-up structure of memory device and method for manufacturing memory device (U.S. Patent No. 12588198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12588198

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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