The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Aug. 19, 2021
Tdk Corporation, Tokyo, JP;
Ryohei Kasai, Tokyo, JP;
Masaki Oikawa, Tokyo, JP;
Susumu Taniguchi, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over ( )}5 cmor more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over ( )}5 cmor less for the light of a wavelength of 250 to 1000 nm.