Power amplifier devices with in-package matching circuits that provide pseudo inverse class f operation

Abstract

A power amplifier device includes an amplification path implemented within a power amplifier package. The amplification path includes input and output package leads, a transistor die with transistor input and output terminals and a power transistor, and a two-stage input impedance matching circuit electrically coupled between the input package lead and the transistor input terminal. The two-stage input impedance matching circuit has a double T-match topology that includes a first resonator coupled to the first input package lead, and a second resonator coupled between the first resonator and the transistor input terminal. The amplification path also includes an output impedance matching circuit coupled between the transistor output terminal and the first output package lead, and a second output harmonic termination circuit coupled to the first output package lead.