The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Jun. 22, 2023
Winbond Electronics Corporation, Taichung City, TW;
Itay Admon, Pardes Hanna, IL;
Nir Tasher, Herzliya, IL;
Winbond Electronics Corporation, Park Taichung City, TW;
Abstract
An IC includes a primary memory die and a secondary memory die. The primary memory die is coupled to a bus providing a primary Chip Select (CS) signal via a primary CS line that connects to the primary memory die. The secondary memory die is coupled to the bus, excluding the primary CS line, and to a secondary CS line carrying a secondary CS signal provided by the primary memory die. The primary memory die is configured to receive a command over the bus, while the primary CS signal is active, in response to identifying that the command is destined to the primary memory die, to execute the command within the primary memory die, and in response to identifying that the command is destined to the secondary memory die, to cause the secondary memory die to execute the command by transferring the primary CS signal on the secondary CS line.